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TSW-104-25-L-D-RA-003123
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TSW-104-25-L-D-RA-003
  • Manufacturer No:
    TSW-104-25-L-D-RA-003
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Headers, Male Pins
  • Datasheet:
    TSW-104-25-L-D-RA-003
  • SKU:
    3568800
  • Description:
    CONN HEADER R/A 8POS 2.54MM

TSW-104-25-L-D-RA-003 Details

CONN HEADER R/A 8POS 2.54MM

TSW-104-25-L-D-RA-003 Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • Mixed Contacts: NO
  • RoHS Status: ROHS3 Compliant
  • Number of Rows: 2
  • ECCN Code: EAR99
  • Contact Finish - Mating: Gold
  • Termination: Solder
  • Factory Lead Time: 3 Weeks
  • Option: GENERAL PURPOSE
  • Pitch - Mating: 0.100 2.54mm
  • Number of Positions: 8
  • Fastening Type: Push-Pull
  • Contact Type: Male Pin
  • Lead Pitch: 2.54mm
  • UL Flammability Code: 94V-0
  • Row Spacing - Mating: 0.100 (2.54mm)
  • Mounting Type: Through Hole, Right Angle
  • Additional Feature: POLARIZED
  • Contact Length - Mating: 0.320 8.13mm
  • Insulation Height: 0.219 5.56mm
  • DIN Conformance: NO
  • Filter Feature: NO
  • MIL Conformance: NO
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Packaging: Bulk
  • JESD-609 Code: e3
  • Insulation Color: Black
  • Operating Temperature: -55°C~125°C
  • Contact Finish - Post: Tin
  • Material Flammability Rating: UL94 V-0
  • Contact Length - Post: 0.100 2.54mm
  • Contact Material: Phosphor Bronze
  • Contact Shape: Square
  • Contact Finish Thickness - Mating: 10.0μin 0.25μm
  • Style: Board to Board or Cable
  • Shrouding: Unshrouded
  • Connector Type: Header
  • Number of Positions Loaded: 7
  • Insulation Material: Polybutylene Terephthalate (PBT)
  • Series: TSW

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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